| Display Type |
Micro-OLED / OLEDoS |
Active-matrix color OLED panel module built on a single-crystal silicon transistor backplane. |
| Display Size |
0.5 inch diagonal |
Compact size for near-eye display modules, electronic viewfinders, and head-mounted display evaluation. |
| Resolution |
1600(H) × 1200(V) |
Real RGB resolution for detailed symbols, UI, viewfinder previews, and optical engine testing. |
| Number of Dots |
5.76M (1600 × 1200 × 3) |
RGB dot count from the official module specification. |
| Usable Display Area |
10.08mm × 7.56mm |
Defines optical magnification, field of view, and mechanical alignment requirements. |
| Pixel Size |
6.3μm × 6.3μm |
Small pixel pitch supports high pixel density in magnified optical systems. |
| Pixel Density |
Approx. 4000 PPI |
Calculated from active display area and resolution; use for optical evaluation only. |
| Luminance |
1000 cd/m² |
Display-side luminance; final eye-side brightness depends on optical transmission efficiency. |
| Contrast Ratio |
100,000:1 typical |
OLED self-emission supports deep-black image areas without a backlight unit. |
| Uniformity |
>85% |
Uniformity condition should follow the datasheet measurement method. |
| Color Gamut |
90% DCI-P3 |
Final color accuracy depends on calibration, gamma settings, and optical stack design. |
| Gray Levels |
256 or 1024 |
Supports different color-depth operating modes depending on driving configuration. |
| Frame Rate |
60Hz to 120Hz |
Host controller timing, thermal behavior, and power margin should be verified at 120Hz. |
| Interface |
MIPI + I2C |
MIPI is used for display data; I2C is used for command and register configuration. |
| MIPI Physical Layer |
MIPI D-PHY v1.1, 1 port, 4 lanes, 1.0Gbps/lane |
Host platform should be checked for lane count, video timing, and initialization sequence. |
| MIPI DSI Mode |
MIPI DSI v1.02 r11 video mode |
Use the official initialization sequence and timing requirements during controller bring-up. |
| Compression |
VESA-DSC v1.1 decoder, 3:1 and 3.75:1 ratios |
Compression mode, bandwidth margin, and visual quality should be tested on the target SoC. |
| Scaling |
x1.33 and x2 supported |
Supports 1200×900 to 1600×1200 and 800×600 to 1600×1200 scaling modes. |
| Power Consumption |
500mW typical |
Specified condition should be verified against actual brightness, frame rate, and image content. |
| Operating Temperature |
-20°C to +70°C |
System-level operation should be validated under the final enclosure and thermal design. |
| Storage Temperature |
-40°C to +80°C |
Relevant for warehousing, logistics, and non-operating device storage. |
| Weight |
TBD |
The preliminary datasheet lists weight as TBD; avoid publishing a fixed weight unless confirmed. |