1.03" Micro OLED Display Module 2560×2560
- 💹 Enjoy a 20% discount for orders over 500
- 📉 A 15% discount is available for orders ranging from 200 to 499
- 🎁 A 10% discount is available for orders ranging from 50 to 199
- 🎁 A 5% discount is available when ordering 10-49
Interested in customizing this product? Get in touch with us.
Order samples, immediate delivery.
Factory bulk lead time: 3 weeks.
1.03" Micro OLED Display Module 2560×2560
- 💹 Enjoy a 20% discount for orders over 500
- 📉 A 15% discount is available for orders ranging from 200 to 499
- 🎁 A 10% discount is available for orders ranging from 50 to 199
- 🎁 A 5% discount is available when ordering 10-49
Resources & Downloads
DM-ADTTR-030 · Micro OLEDoS Display Module
1.03" Micro OLEDoS Display Module 2560×2560 RGB
This 1.03-inch silicon-based Micro OLED display module provides 2560(H) × 2560(V) RGB resolution, approximately 3500 PPI pixel density, 1800 cd/m² typical luminance, and 500,000:1 typical contrast ratio for compact near-eye optical systems, electronic viewfinders, medical visualization devices, and industrial optical instruments.
The display uses a silicon backplane with integrated panel driver and logic driver architecture. The active area is 18.432 mm × 18.432 mm, the pixel size is 7.2 µm × 7.2 µm, and the subpixel count is 19.66 million dots based on 2560 × 2560 × 3. Confirm final mechanical, electrical, timing, and reliability values against the official datasheet before product design freeze.
2560×2560
RGB Resolution
~3500 PPI
Pixel Density
1800 cd/m²
Typical Luminance
500,000:1
Typical Contrast
7.2 µm
Pixel Size
18.432 mm
Active Area Width
Optical, Mechanical & Electrical Specifications
| Parameter | Specification |
|---|---|
| Display Type | Micro OLED, silicon-based |
| Diagonal Size | 1.03 inch |
| Resolution | 2560(H) × 2560(V) |
| Subpixel Count | 19.66M dots, calculated as 2560 × 2560 × 3 |
| Pixel Density | Approximately 3500 PPI |
| Pixel Size | 7.2 µm × 7.2 µm |
| Pixel Arrangement | RGB π type |
| Active Area | 18.432 mm × 18.432 mm |
| Luminance | 1800 cd/m² typical |
| Contrast Ratio | 500,000:1 typical |
| Color Gamut | 90% DCI-P3 |
| Gray Levels | 256 |
| Interface | MIPI, 1-port or 2-port D-PHY |
| Frame Rate | 60 Hz to 90 Hz |
| Power Consumption | 1600 mW typical at 1800 nits, 100% duty |
| Operating Temperature | -20°C to +70°C |
| Storage Temperature | -40°C to +80°C |
| Weight | Approximately 2 g |
Pixel Architecture & Image Performance
RGB Pixel Structure
The 2560 × 2560 RGB structure equals 19.66 million subpixels. This supports dense image rendering for magnified near-eye optics where pixel structure and edge clarity are important evaluation items.
Brightness Budget
The 1800 cd/m² typical luminance should be used as the display-side reference. Final eye-side brightness depends on lens, prism, waveguide, coating, brightness setting, and optical transmission efficiency.
Typical Contrast
The OLED self-emissive structure provides pixel-level light control. The listed 500,000:1 typical contrast helps improve dark-scene readability in controlled optical paths.
Color and Calibration
The 90% DCI-P3 color gamut supports vivid image output. For color-critical products, validate gamma, white point, driving tables, and optical stack color shift in the final system.
Interface, Driver & System Integration
MIPI D-PHY Video Interface
The module supports MIPI D-PHY with 1-port or 2-port configuration. Confirm lane configuration, selected frame rate, video timing, and host-side bandwidth before PCB release.
Integrated Driver Architecture
The panel driver and logic driver are integrated into the silicon-based display architecture, reducing external driver complexity in compact near-eye and viewfinder systems.
DSI Video Mode & DSC
The module is described with DSI video mode and in-chip VESA-DSC decoder support. Validate DSC mode, compression setting, initialization sequence, and image quality with the selected host controller.
Temperature Compensation and Operating Limits
Built-in temperature compensation may help maintain display behavior across operating conditions. The listed operating range is -20°C to +70°C, and the storage range is -40°C to +80°C. Use the official datasheet for final limit verification.
Mechanical Dimension Reference
18.432 mm
Active width
18.432 mm
Active height
7.2 µm
Pixel pitch
~2 g
Approx. weight
Use the official mechanical drawing to confirm active area position, optical center, display outline, FPC direction, connector position, keep-out area, and mounting tolerance before tooling.
Application Fit by Engineering Requirement
Virtual Reality and Enclosed Near-Eye Displays
2560 × 2560 resolution and approximately 3500 PPI support dense image rendering in magnified optics. Final perceived sharpness depends on lens MTF, focus distance, field of view, and optical alignment.
AR Optical Evaluation
The 1800 cd/m² typical display-side luminance requires system-level brightness budgeting for see-through AR. Final suitability depends on waveguide or prism efficiency, ambient-light target, eye-box design, and product brightness requirement.
Medical Visualization
High contrast, RGB pixels, and 90% DCI-P3 color coverage can support medical viewer and visualization prototypes. Product teams should validate regulatory, cleaning, reliability, color, and system safety requirements separately.
Industrial Optical Equipment
The compact active area, low module weight, MIPI interface, and operating temperature range support evaluation for inspection equipment, measurement tools, portable instruments, and professional imaging devices.
Selection Notes for OEM Engineering Teams
01. Optical Engine Match
Use the 18.432 mm × 18.432 mm active area and 7.2 µm pixel size to calculate magnification, field of view, eye box, perceived angular resolution, and alignment tolerance.
02. Bandwidth Planning
Confirm that the host processor supports the required MIPI D-PHY configuration for 2560 × 2560 output at the selected frame rate and compression setting.
03. Thermal Design
Power consumption is listed as 1600 mW typical at 1800 nits and 100% duty. Mechanical design should include thermal margin for continuous high-brightness operation.
04. Image Tuning
Confirm gamma, brightness control, refresh rate, color target, temperature compensation behavior, image retention risk, and long-run stability during prototype validation.
Specification Basis & Trust Signals
Datasheet-Driven Values
Key specifications are presented as engineering values, including resolution, luminance, contrast ratio, active area, pixel size, interface, frame rate, operating temperature, and power consumption.
Clear Technical Limits
Typical brightness, typical contrast, power condition, operating temperature, and storage temperature are stated with their conditions where available, helping engineers compare the module against system requirements.
Procurement Clarity
For OEM projects, confirm sample availability, MOQ, lead time, FPC customization, driver board support, inspection criteria, and lifecycle supply plan before final hardware design freeze.
Technical Resources
Datasheet
Use the datasheet to verify absolute maximum ratings, timing information, mechanical drawings, electrical tables, register details, and display control requirements.
Interface Review
Review MIPI D-PHY lane configuration, DSI video mode compatibility, DSC support, initialization flow, EMI risk, and host-side signal requirements.
Integration Review
Check mechanical stack-up, FPC routing, thermal path, optical alignment, production test method, and sample-to-volume requirements before transition.
DM-ADTTR-030 Datasheet
Download the technical document before schematic design, optical simulation, or prototype validation.