1.03" Micro OLEDoS Display 2560x2560 90Hz 3000nits - MIPI
- 💹 Enjoy a 20% discount for orders over 500
- 📉 A 15% discount is available for orders ranging from 200 to 499
- 🎁 A 10% discount is available for orders ranging from 50 to 199
- 🎁 A 5% discount is available when ordering 10-49
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1.03" Micro OLEDoS Display 2560x2560 90Hz 3000nits - MIPI
- 💹 Enjoy a 20% discount for orders over 500
- 📉 A 15% discount is available for orders ranging from 200 to 499
- 🎁 A 10% discount is available for orders ranging from 50 to 199
- 🎁 A 5% discount is available when ordering 10-49
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DM-OLED103-1010 · Micro OLEDoS Display Module
1.03" Micro OLEDoS Display 2560×2560, 90Hz, 3000nits - MIPI
This 1.03-inch Micro OLEDoS display module is built for compact near-eye and viewfinder optical systems that require high pixel density, high panel luminance, and a silicon-based active matrix architecture.
According to the product datasheet, the module provides 2560(H) × 2560(V) resolution, 18.432mm × 18.432mm usable display area, 7.2μm × 7.2μm pixel size, RGBπ pixel arrangement, 3000 cd/m² typical luminance, 500,000:1 typical contrast ratio, MIPI + I2C interface, and 2g module weight.
2560×2560
Real RGB Resolution
3000 cd/m²
Typical Panel Luminance
500,000:1
Typical Contrast Ratio
60Hz-90Hz
Mode-Dependent Frame Rate
Usable Area: 18.432mm × 18.432mm
Pixel Size: 7.2μm
Weight: 2g
Datasheet-Based Display Parameters
Silicon Backplane Architecture
The panel is based on single-crystal silicon transistors and integrates panel driver and logic driver functions, supporting a compact high-resolution microdisplay structure for near-eye optical designs.
Near-Eye Image Density
The 2560×2560 square format and 7.2μm pixel pitch provide dense image sampling for magnified optical systems, helping reduce visible pixel structure after optical enlargement.
Brightness Budget Required
Use 3000 cd/m² as the panel-side typical luminance reference. Eye-side brightness must be calculated after lens, waveguide, prism, coating, and combiner losses.
Temperature Compensation
The module supports temperature compensation. The operating temperature range is -20°C to +70°C, and storage temperature range is -40°C to +80°C.
Optical, Electrical & Mechanical Specifications
| Parameter | Specification | Engineering Note |
|---|---|---|
| Resolution | 2560(H) × 2560(V) | Square high-resolution format for near-eye display and viewfinder optical systems. |
| Number of Dots | 19.66M | 2560 × 2560 × 3 sub-pixel dot count according to the datasheet. |
| Usable Display Area | 18.432mm × 18.432mm | 1.03-inch diagonal usable display area for optical alignment and module design. |
| Pixel Size | 7.2μm × 7.2μm | Small pixel pitch supports dense image sampling in magnified optical paths. |
| Pixel Arrangement | RGBÏ€ Type | Full-color sub-pixel arrangement defined in the product datasheet. |
| Luminance | 3000 cd/m² Typical | Panel-side luminance under specified optical measurement conditions. |
| Contrast Ratio | 500,000:1 Typical | Datasheet typical value; system-level contrast depends on the optical engine and ambient conditions. |
| Uniformity | >85% | Defined by datasheet measurement conditions at highest gray level and 100% duty emission. |
| Color Gamut | 90% DCI-P3 Typical | Use module-level color calibration after optical assembly for final product evaluation. |
| Gray Levels | 256 | Datasheet-listed gray-level depth for display driving configuration. |
| Frame Rate | 60Hz-90Hz | Mode-dependent. Datasheet notes 1920×1920 input with 1.33× scaling and DSC can reach up to 90Hz; 2560×2560 input with DSC is listed up to 75Hz. |
| Interface | MIPI + I2C | MIPI D-PHY v1.2, one/two port, 4/8 lanes, 1.0Gbps/Lane, MIPI DSI video mode, plus I2C control. |
| DSC & Scaling | VESA-DSC v1.1 | Supports in-chip DSC decoder with 3X compression ratio and 1.33× / 2× scaling modes. |
| Operating Voltage | VDDI 1.8V | Analog rails: AVDD 5.8V~6V and AVEE -4V~-5.5V. Confirm rail sequencing before PCB release. |
| Power Consumption | 2400mW | Datasheet condition: 3000nits, 100% duty, 1920×1920 input, 1.33× scaling up, no DSC, 72Hz. |
| Temperature Range | -20°C to +70°C | Storage range: -40°C to +80°C. Validate actual enclosure temperature under continuous operation. |
| Module Weight | 2g | Low module weight supports compact optical assemblies and head-mounted prototypes. |
MIPI Integration Details
MIPI D-PHY v1.2
The module supports MIPI D-PHY v1.2 with one-port or two-port operation. Designers should select 4-lane or 8-lane routing based on bandwidth, connector, PCB stack-up, and host processor capability.
VESA-DSC v1.1 Decoder
The in-chip VESA-DSC v1.1 decoder supports a 3X compression ratio. Validate final DSC settings and image quality with the selected host platform.
Scaling Modes
The module supports 1.33× scaling from 1920×1920 to 2560×2560 and 2× scaling from 1280×1280 to 2560×2560, allowing system designers to balance rendering load, bandwidth, frame rate, and power.
Integration check before EVT board release
Confirm MIPI lane count, connector pin assignment, power rail sequencing, negative voltage generation, ground return path, display initialization timing, I2C control, DSC enable configuration, FPC bend radius, and thermal derating.
Application Fit by Engineering Requirement
R / VR Head-Mounted Display Prototypes
The 1.03-inch square format, 2g module weight, and high pixel density can be evaluated for compact near-eye optical engines. Final eye-side brightness and thermal margin must be calculated at system level.
Electronic Viewfinders
The 2560×2560 resolution, OLED contrast, and MIPI video input support engineering evaluation for camera EVF, microscope viewfinder, inspection viewer, and portable optical instrument designs.
Medical / Clinical Visualization Evaluation
The module may be evaluated as a display component for visualization equipment. Final medical-device safety, reliability, optical performance, and regulatory compliance must be verified by the finished product developer.
Industrial Optical Instruments
The compact display area, high contrast, MIPI interface, and storage temperature range make the module relevant for inspection equipment, measurement instruments, professional viewfinders, and optical terminals.
Design Review Checklist for OEM Projects
Optical Path Budget
Calculate eye-side brightness after lens, waveguide, prism, coating, combiner, polarizer, and mechanical light leakage losses.
Host Controller Matching
Verify MIPI DSI video mode, D-PHY lane configuration, 1.0Gbps/Lane operation, DSC support, scaling mode, and I2C initialization.
Power Rail Sequencing
Design stable VDDI, AVDD, and AVEE rails. Confirm ramp timing, ripple, transient response, and shutdown sequence.
Thermal Validation
Check panel and enclosure temperature at high brightness, continuous operation, and final mechanical packaging conditions.
Image Calibration
Validate gamma, brightness adjustment, scanning direction, sequential/global emission behavior, color consistency, and image retention risk after assembly.
Technical Resources & Product Evidence
Official Datasheet
Use the datasheet to review mechanical drawings, electrical ratings, interface timing, MIPI settings, I2C control, register configuration, optical measurement conditions, and reliability limits before PCB layout or optical tooling.
Evidence-Based Product Page
This page focuses on measurable product information: resolution, usable area, pixel size, luminance, contrast ratio, color gamut, frame rate conditions, interface, voltage rails, power condition, temperature range, and downloadable datasheet.
OEM / ODM Engineering Support
Project support may include display selection, FPC customization discussion, optical module matching, driver board discussion, initialization support, sample evaluation, volume pricing, and long-term supply planning.
Request Datasheet Review, Samples, or OEM Integration Support
Share your target input resolution, MIPI host platform, optical architecture, brightness target, operating environment, expected annual quantity, and sample schedule.
The engineering team can help verify display fit, interface feasibility, mechanical integration, power requirements, and datasheet details before prototype design.